Strategi Merekabentuk Papan Litar Tercetak (PCB)
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Strategi Merekabentuk Papan Litar Tercetak (PCB)KL 3083 Rekabentuk Sistem Hilmi Sanusi
Strategi Awal Spesifikasi Dimensi Susun-atur komponen
Aplikasi Kegunaan alat pada tahap frekuensi: DC Frekuensi rendah Julat audio Frekuensi tinggi Gelombang mikro
Persekitaran Hingar dari EMC RFI dan EMI Julat suhu
SpesifikasiAkan menghadkan rekabentuk dari segi Kekangan bentuk dimensi, bulat, bujur, segi empat tepat dll bentuk PCB
Kekangan susun-atur komponen input, output, penyesaran haba, bypass capacitor
Aplikasi Litar Keperluan yang sesuai bagi rekaan PCB pembumian lebar track jenis dielectric ketebalan track
Keperluan bagi track Arus Isyarat yang melaluinya Analog Digital
Gangguan dari perambatan yang terhasil dari arus yang mengalir dalam track
Hasil dari keperluan litar Jenis pembumian yang sesuai Penyusunan modular melalui segmen interaksi EMC
Jenis track Bus track corner junction
Jenis pad luas pad kedudukan pad jenis pad
Jenis penyambungan Jumper via
PCB
Low Frequency
High frequency
DC
High frequency
Low frequency < 400Hz
Microwave
Audio range
Noise Interference Power line modulation Back propagation from switching single layer Double layer (Isolation) grounding
Emc rfi & emi Capacitive and inductive effect of the track and patch Track corner Shielding effect Skin effect Multiple layer Two layer (microstrip)
Application
Operating frequency
Dimension limitation and component
Specification
Track width Type of ground Interconnect
Component selection to satisfy the Specification Footprint of the selected component
Segmentation Modular
What are the information needed Layer / type of the board EMC Track width Overall design Modular / segment / component placement PCB shape and dimension limitation Components selection Footprint and dimension
Overall design
Overall design
Overall design
Components selectionDimension Footprint Usage - Tolerance - specification - rating
Module (PCB) placement in the system
Circuit BOM (specification)
Components selection Based on Rating Specification dimension
Components footprint
Components dimension
Components: dimension and footprint
Components: dimension and footprint
PCB - dimension
Placement of components
Placement of components pad (footprint)
Routing of the track
Routing of the track
Adjustment to the components
Re-routing of the track
Track of the PCB
Component side of the PCB
PCB software: example
schematic diagram: netlist
Rat-nest of the netlist
Interconnect: via
Simple Quiz .??